Semiconductor Packaging Exchange Program
With its 14 different schools, Han University’s degree programs, research teams and professional fields come together to analyze a wide range of social issues and their possible solutions. Among the many academic opportunities provided by the Institute, the main one is getting acquainted with the semiconductor industry by taking part in the Semiconductor Packaging Exchange Program. The program includes the design and manufacturing of semiconductor packages as well as all associated skills and technologies. The 2-blocks, 9-weeks module delves into the theory of semiconductor packaging, its assembly, reliability and testing. It also deals with more challenging semiconductor packaging criticalities, prompting the design of new prototypes and demonstrations of their working principles and feasibility. Some of the areas of study that will be touched upon during the program include:
1. Microelectronics and Packaging (materials, process steps)
2. Assembly of photonic ICs (couplers, fiber connections)
3. Applications and Trends (automotive, mobile, health)
4. Simulation and Advanced Materials (thermal, mechanical)
5. Reliability, Quality and Testing (lifetime, FA, SPC, PPM, pass/fail)
Teaching language: english
Duration: 1 semester
Semiconductor Packaging exchange program: topics (hanuniversity.com)
